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| Double Balanced Mixers (Relay Headers) MC-600R Series These mixers mix the RF signal and LO signal to produce the IF signal (i.e., fIF = fRF - fLO) sFeatures 1.Suited for High-Density Mounting Ultraminiature design with a 2.54 mm pitch enables high-density mounting. 2.LO Level of +7 dBm Mixers operate at a LO level of +7 dBm. MC-602R 3.Highly Reliable Design The metal case is designed with a hermetically sealed construction which contains inert gas. This permits quality to be maintained over a long period. 4.Easy Soldering MC-601R The leads have received solder dip processing which makes soldering work easier. 5.Prevention of Flux Creepage Use of the supplied Teflon sheet permits the prevention of solder flux creepage. sProduct Specifications Ratings Frequency range (Note) Characteristic impedance Maximum Input Power (Total input power) Item 1.Vibration 2.Shock 3.Temperature cycle No damage, cracks, or parts dislocation 30 to 1800 MHz 50 ohms 30 mW Operating temperature range Operating relative humidity -10c to +65c 95% Max. Note: The frequency range will differ depending on the products. Standard Conditions Frequency of 10 to 2000 Hz, overall amplitude of 1.5 mm, acceleration of 98 m/s2 for 4 hours in each of 3 directions Acceleration of 294 m/s2, sine half-wave waveform, 3 cycles in each of the 3 axis Temperature: -35c +5c to +35c +80c +5c to +35c Time: 30 15 max. 30 15 max. (Minutes) 5 cycles qThe test method conforms to MIL-STD-202. sMaterials Part External Cladding Contacts Hermetic seal sExternal Dimensions Teflon sheet (t=0.2) Material Iron Iron-nickel alloy Glass Finish Nickel plating Solder dip ---------- sOrdering Information Green hermetic seal 1.6 mm dia. MC - 6 0 1 R 1 2345 4 Suffix 1 Series Name: MC 2 6: Indicates double balanced mixer. 5 Form of Case R: Relay header 3 LO level 0: +7dBm sFunction Diagram 2, 5, 6, and 7 are ground. (Note that 2 is case ground.) 2, 3, 5, 6, and 7 are ground. (Note that 2, 3, 5, 6, and 7 are case ground.) 54 sSpecifications Part Number Frequency Range (MHz) RF/LO IF DC~700 30~200 LO Power (dBm) Conversion Loss (dB Max) Isolation (dB Min) LO-RF LO-IF 15 RF Input for 1dB Compression Level (dBm typ.) +3 +5 Weight (g) MC-601R MC-602R 30~700 600~1,800 +7 +7 9.5 9.5 20 3 3 20(,0600~1,000) 15(,0600~1,000) 15(1,000~1,800) 10(1,000~1,800) NOTE: The frequency range will differ depending on the product. sTypical Data MC-601R MC-602R 55 sCircuit Diagrams MC-601R Numbers in parentheses ( ) indicate port numbers. MC-602R sPCB Mounting Pattern (Parts mounting side) Land (NOTE 1) Through hole (Parts mounting side) Land (NOTE 1) Through hole (Soldering side) (Soldering side) (NOTE 2) (NOTE 2) MC-601R MC-602R Note 1: One example is given for the form dimensions of the land. Note 2: When glass epoxy board ( r~ 4.7 ) of 0.8 mm thickness is used, the width (W) of the 50o impedance micro stripline becomes W 1.4 mm. _ sPrecautions qThis product uses diodes and therefore care must be taken against static electricity when handling. When using a soldering iron, please solder with a grounded soldering iron. The soldering conditions are as described below. Soldering temperature: 260c or less Soldering time: 10 seconds or less qPlease use the supplied Teflon sheet to prevent solder flux creepage and so that the leads do not become shorted due to solder flowing to the board mounting surface. 56 |
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